Die Processing Capability
Eltek provides the following capabilities which can be tailored to meet individual customer needs.
Quality Levels:
- Commerical
- Automotive
- Industrial
- Military
- Space
Back Lapping:
- 8" / 200mm wafer
- 290, 370 and 480 microns +/-25 um
- 4", 5" and 6" also available
Wafer Probe:
- Ambient to 200 deg.C
- Up to 8" / 200mm
- Automatic handling
- Actel approved FPGA programming
Wafer Sawing:
- Up to 8" / 200mm
- Dual and single spindle
- Stepped and bevelled cut
- Automatic handling
- Single or part wafer flexibility
Visual Inspection:
- MIL-STD-883 method 2010 cond. A or B
- MIL-STD-750 method 2072 or 2073
- Customer specification
Optional Lot Qualification to:
- MIL-STD-883
- MIL-PRF-38534
- Customer specification
Shipping Formats:
- Waffle trays
- Gel-Pak®
- Tape and reel / Surftape®
- Sawn wafer on film
- Wafer