Sub-Contract Services
Eltek Semiconductors offers a range of sub-contract packaging, test and screening services. Our flexible factory is optimised for a 'pick and mix' approach to meet individual customer requirements.
We can perform single, one-off tests such a constant acceleration or temperature cycling or provide complete end-to-end process flows such as MIL-STD-883 method 5004.
We have a range of standard flows which span a wide range of quality requirements, from commercial to military level product. Customer defined flows are also routinely supported.
In many cases these services are combined with procurement of silicon on behalf of customers to provide a complete 'turn-key' solution.
Our processes include;
Assembly into hermetic packaging:
- Eutectic / epoxy / polyimide die attach
- Gold / aluminium wire bonding
- Die shear test per MIL-STD-883 method 2019 for ICs
- Bond strength test per MIL-STD-883 method 2011 ICs
Internal Visual Inspection:
- Per MIL-STD-883 method 2010 condition A or B
- Or customer requirement
Temperature Cycling:
- Per MIL-STD-883 method 1010
- Or customer requirement
Constant Acceleration (Centrifuge):
- Per MIL-STD-883 method 2001 condition E
- Or customer requirement
Fine and Gross Leak Testing:
- Per MIL-STD-883 method 1014
- Or customer requirement
Burn-In:
- 160 hours @ 125 deg.C per MIL-STD-883 method 1015
- Or customer requirement
- Static, dynamic, semi-dynamic
Electrical testing:
- -55 deg.C to +200 deg.C
- Analog and digital
- Memory and microcontroller
- Programmable logic and ASIC
Characterisation:
- Device serialization
- Data-logging
- Parametric distribution analysis
Qualification and Quality Conformance:
- Electrical parameters
- Mechanical package related tests
- Die related life testing
- Customer specified programmes